Emerson will begin accepting applications for its 2019 ASCO Engineering Scholarship program, which rewards students who have the potential for leadership and contributions to the engineering profession.
The program awards two $5,000 scholarships to U.S. engineering students, provides $1,000 grants to their colleges’ engineering departments and hosts the students at “The Amazing Packaging Race” at PACK EXPO International in 2019. Applications will be accepted through April 23, 2019.
Since the first award 11 years ago, $110,000 in scholarships have been granted to 22 U.S. students, making a significant contribution to the engineering profession. In addition, the engineering departments of the colleges where the recipients are enrolled have received $22,000 in grants for education research.
Students seeking to submit a scholarship application must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2019/2020 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale and be a U.S. citizen or legal U.S. resident.
The scholarship will be awarded at “The Amazing Packaging Race” held the third and final day of PACK EXPO International, Sept. 23 – 25, 2019 in Las Vegas, Nevada. The race, sponsored by Emerson, is a fun and educational event that pits teams of college students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.